HTS 8486.10.00 duty rate
Machines and apparatus for the manufacture of boules or wafers. General duty Free; for goods of Chinese origin, general + Section 301 (+25%) comes to 25% before any other duties.
| Tariff line | 8486.10.00 |
|---|---|
| Description | Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(C) to this chapter; parts and accessories: › Machines and apparatus for the manufacture of boules or wafers |
| General rate | Free |
| Special rate (trade programs) | none listed |
| Column 2 rate | 35% |
| Units of quantity | No. |
| Section 301 (China) | List 2 +25% (7 product exclusions may apply) |
Section 301 China tariffs on this line
| Chapter 99 heading | List | Extra duty | Status |
|---|---|---|---|
| 9903.88.02 | List 2 | +25% | in effect |
Product exclusions
- 8486.10.00.00 (9903.88.70): Silicon growth furnaces, including Czochralski crystal growth furnaces, designed for growing monocrystalline silicon ingots (boules) of a mass exceeding 700 kg, for use in solar wafer manufacturing (described in statistical reporting number 8486.10.0000) Until November 9, 2026.
- 8486.10.00.00 (9903.88.70): Band saws designed for cutting or slicing cylindrical monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into square or rectangular ingots (boules), for use in solar wafer manufacturing (described in statistical reporting number 8486.10.0000) Until November 9, 2026.
- 8486.10.00.00 (9903.88.70): Machines designed to align and adhere square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 200 kg to plastic support boards on metal mounting plates to provide support during diamond wire sawing, for use in solar wafer manufacturing (described in statistical rep Until November 9, 2026.
- 8486.10.00.00 (9903.88.70): Diamond wire saws designed for cutting or slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers (described in statistical reporting number 8486.10.0000) Until November 9, 2026.
- 8486.10.00.00 (9903.88.70): Wire guide roller machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturin Until November 9, 2026.
- 8486.10.00.00 (9903.88.70): Coolant fluid recycling machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufa Until November 9, 2026.
- 8486.10.00.00 (9903.88.70): Degumming machines designed to remove adhesives from solar wafers (described in statistical reporting number 8486.10.0000) Until November 9, 2026.
2026 US–China tariff reduction lists: The US–China reduction lists are not published yet. Dutyfinch checks the Federal Register every day and flags each code as soon as the list appears.
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Nearby tariff lines
8486.20.00 · 8486.30.00 · 8486.40.00 · 8486.90.00
← 8485.90.90 · 8486.20.00 → · Heading 8486 · Chapter 84 · Chapter 84 rate summary
General information from the official US Harmonized Tariff Schedule (USITC) and Federal Register; not legal or customs advice. Section 232, IEEPA, antidumping/countervailing and other duties can also apply. Confirm classification and rates with CBP or a licensed customs broker before you file.